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- W1536733004 abstract "An ultralow inductance I/O interconnect, called a coaxial polymer pillar (CoPP) is introduced that is compatible with sea of polymer pillars (SoPP) recently presented. Polymer pillars are highly process-integrated and mechanically flexible (compliant) electrical-optical I/O interconnections that mitigate thermomechanical expansion mismatches. The 100x smaller parasitic inductance of the CoPP (in the range of 0.1 pH) compared to the inductance of a solder bump or a regular polymer pillar makes it an excellent I/O interconnect technology for power distribution. The density of CoPPs may exceed 10/sup 5//cm/sup 2/." @default.
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- W1536733004 date "2004-12-23" @default.
- W1536733004 modified "2023-09-23" @default.
- W1536733004 title "Coaxial polymer pillars: ultra-low inductance compliant waferlevel electrical input/output interconnects for power distribution" @default.
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- W1536733004 doi "https://doi.org/10.1109/socc.2004.1362356" @default.
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