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- W1537330108 abstract "This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very serious during high current stressing, and a hot spot exists in the solder bump. The hot spot may play important role in the void formation and thermomigration in solder bumps during electromigration." @default.
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- W1537330108 date "2006-07-10" @default.
- W1537330108 modified "2023-09-22" @default.
- W1537330108 title "Joule Heating Effect under Accelerated Electromigration in Flip-Chip Solder Joints" @default.
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- W1537330108 doi "https://doi.org/10.1109/ectc.2006.1645721" @default.
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