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- W1547047800 abstract "Electronic packages with fine pitch copper pillar bump interconnect and thin coreless substrate has become a satisfying solution for advanced integrated circuit (IC) to achieve miniaturization and high performance. However, non-wetting and poor interconnection issues of small and fine pitch copper pillar bumps due to large warpage of thin coreless substrate are the most common failure phenomenon during flip chip reflow process. In this work, the warpage of thin two layer coreless substrate during flip chip reflow process is comprehensively studied by using Shadow Moire technique. A few design options are proposed and analyzed by DOE methodology, including prepreg stack-up design, metal trace design, designs with different metal layer thickness and solder mask thickness. These design options are then studied to understand their effectiveness for warpage improvement, and to figure out the optimized designs for minimum substrate warpage. From the results, it is found that the prepreg stack-up design is not effective for warpage reduction, but a significant option for improving warpage consistency at different location through the whole substrate strip during reflow process, choosing proper lamination process is helpful and important. Increasing metal layer thickness is an effective way for warpage improvement. Thick metal layer is not only beneficial for warpage reduction but also shows more consistency of warpage at different location through the whole substrate strip. It is also found that the thinner solder mask is an effective way for warpage reduction and warpage consistency improvement. Metal trace design is not effective for substrate warpage improvement. Final optimized design is obtained to improve substrate warpage, and to eliminate non-wetting and poor interconnection issues. The assembly yield of flip chip process can be substantially improved from 85.7% in preliminary design to 99.7% after optimization." @default.
- W1547047800 created "2016-06-24" @default.
- W1547047800 creator A5040230367 @default.
- W1547047800 creator A5042643943 @default.
- W1547047800 creator A5057978069 @default.
- W1547047800 creator A5066028215 @default.
- W1547047800 creator A5070331807 @default.
- W1547047800 creator A5071253523 @default.
- W1547047800 creator A5077084593 @default.
- W1547047800 creator A5079240448 @default.
- W1547047800 date "2015-05-01" @default.
- W1547047800 modified "2023-09-22" @default.
- W1547047800 title "Development of high yield, reliable fine pitch flip chip interconnects with copper pillar bumps and thin coreless substrate" @default.
- W1547047800 cites W1593042597 @default.
- W1547047800 cites W1974962302 @default.
- W1547047800 cites W1990457933 @default.
- W1547047800 cites W2026045452 @default.
- W1547047800 doi "https://doi.org/10.1109/ectc.2015.7159828" @default.
- W1547047800 hasPublicationYear "2015" @default.
- W1547047800 type Work @default.
- W1547047800 sameAs 1547047800 @default.
- W1547047800 citedByCount "2" @default.
- W1547047800 countsByYear W15470478002016 @default.
- W1547047800 countsByYear W15470478002019 @default.
- W1547047800 crossrefType "proceedings-article" @default.
- W1547047800 hasAuthorship W1547047800A5040230367 @default.
- W1547047800 hasAuthorship W1547047800A5042643943 @default.
- W1547047800 hasAuthorship W1547047800A5057978069 @default.
- W1547047800 hasAuthorship W1547047800A5066028215 @default.
- W1547047800 hasAuthorship W1547047800A5070331807 @default.
- W1547047800 hasAuthorship W1547047800A5071253523 @default.
- W1547047800 hasAuthorship W1547047800A5077084593 @default.
- W1547047800 hasAuthorship W1547047800A5079240448 @default.
- W1547047800 hasConcept C111368507 @default.
- W1547047800 hasConcept C123745756 @default.
- W1547047800 hasConcept C125619702 @default.
- W1547047800 hasConcept C127313418 @default.
- W1547047800 hasConcept C127413603 @default.
- W1547047800 hasConcept C159985019 @default.
- W1547047800 hasConcept C192562407 @default.
- W1547047800 hasConcept C24326235 @default.
- W1547047800 hasConcept C2777289219 @default.
- W1547047800 hasConcept C2779227376 @default.
- W1547047800 hasConcept C49040817 @default.
- W1547047800 hasConcept C50296614 @default.
- W1547047800 hasConcept C68928338 @default.
- W1547047800 hasConcept C76155785 @default.
- W1547047800 hasConcept C79072407 @default.
- W1547047800 hasConceptScore W1547047800C111368507 @default.
- W1547047800 hasConceptScore W1547047800C123745756 @default.
- W1547047800 hasConceptScore W1547047800C125619702 @default.
- W1547047800 hasConceptScore W1547047800C127313418 @default.
- W1547047800 hasConceptScore W1547047800C127413603 @default.
- W1547047800 hasConceptScore W1547047800C159985019 @default.
- W1547047800 hasConceptScore W1547047800C192562407 @default.
- W1547047800 hasConceptScore W1547047800C24326235 @default.
- W1547047800 hasConceptScore W1547047800C2777289219 @default.
- W1547047800 hasConceptScore W1547047800C2779227376 @default.
- W1547047800 hasConceptScore W1547047800C49040817 @default.
- W1547047800 hasConceptScore W1547047800C50296614 @default.
- W1547047800 hasConceptScore W1547047800C68928338 @default.
- W1547047800 hasConceptScore W1547047800C76155785 @default.
- W1547047800 hasConceptScore W1547047800C79072407 @default.
- W1547047800 hasLocation W15470478001 @default.
- W1547047800 hasOpenAccess W1547047800 @default.
- W1547047800 hasPrimaryLocation W15470478001 @default.
- W1547047800 hasRelatedWork W1487971559 @default.
- W1547047800 hasRelatedWork W1537028974 @default.
- W1547047800 hasRelatedWork W1570896206 @default.
- W1547047800 hasRelatedWork W1915817375 @default.
- W1547047800 hasRelatedWork W1986637956 @default.
- W1547047800 hasRelatedWork W2008609724 @default.
- W1547047800 hasRelatedWork W2036893280 @default.
- W1547047800 hasRelatedWork W2049355244 @default.
- W1547047800 hasRelatedWork W2070713558 @default.
- W1547047800 hasRelatedWork W2075365888 @default.
- W1547047800 hasRelatedWork W2078924690 @default.
- W1547047800 hasRelatedWork W2138993883 @default.
- W1547047800 hasRelatedWork W2141072971 @default.
- W1547047800 hasRelatedWork W2160769807 @default.
- W1547047800 hasRelatedWork W2164622698 @default.
- W1547047800 hasRelatedWork W2279639360 @default.
- W1547047800 hasRelatedWork W2381965685 @default.
- W1547047800 hasRelatedWork W2511518554 @default.
- W1547047800 hasRelatedWork W2550261252 @default.
- W1547047800 hasRelatedWork W3190454200 @default.
- W1547047800 isParatext "false" @default.
- W1547047800 isRetracted "false" @default.
- W1547047800 magId "1547047800" @default.
- W1547047800 workType "article" @default.