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- W1549372100 abstract "In this study, we designed an S-type micro-spring for a probe card and fabricated it by UV-LIGA/Ni electroforming. The mechanical properties of electroformed Ni exhibits a lower Young's modulus and a much higher tensile strength than those of conventional bulk material. Using a scanning electron microscope, a newly developed testing machine enables in-situ observation of a microspring during and after loading cycles. During repeated cycles, voids developed on the surface of the microspring, resulting in a decreased spring constant. This determines fatigue strength, and the S-N curves indicate superior characteristics." @default.
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- W1549372100 date "2003-10-08" @default.
- W1549372100 modified "2023-10-10" @default.
- W1549372100 title "Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring" @default.
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- W1549372100 doi "https://doi.org/10.1109/memsys.2003.1189838" @default.
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