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- W1549397850 abstract "A flip-chip packaging technique with submicron alignment precision, using V-grooved Si motherboards, allows the realization of OEIC modules with self-aligned coupling of single mode fiber arrays to waveguide arrays together with direct optical connection of different, separately optimized waveguide devices. The passive optical self-alignment of array interconnections combined with the relatively large mounting and etching tolerances of the Si motherboard is promising as a generally useful, high precision, low cost packaging technique for OEICs." @default.
- W1549397850 created "2016-06-24" @default.
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- W1549397850 date "2002-12-17" @default.
- W1549397850 modified "2023-10-03" @default.
- W1549397850 title "Low-loss, self-aligned flip-chip technique for interchip and fiber array to waveguide OEIC packaging" @default.
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- W1549397850 doi "https://doi.org/10.1109/leos.1994.586535" @default.
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