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- W1550268524 abstract "Publisher Summary Chemical–mechanical planarization (CMP) has become increasingly popular in integrated circuit manufacturing. Several applications of CMP have been discovered—for example, CMP can be used for premetal dielectrics (PMD) and shallow trench isolation (STI). Metal CMP was once used for tungsten plug processing only, but now it is used for all damascene processes (tungsten, aluminum, and copper). Slurry consists of two major components: abrasives and solution. Each kind of slurry behaves differently depending on the material of the abrasives, the chemistry of the slurry, and the synergy among them. The slurry solution plays a different role between oxide (as a hydrolizer) and metal (as an oxidizer) slurries. It is more complex in metal than in oxide, because oxide slurry is used only for polishing oxide (e.g., for ILD), whereas the metal slurry (e.g., for tungsten) is used to polish tungsten, titanium nitride, titanium, and oxide." @default.
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- W1550268524 date "1999-01-01" @default.
- W1550268524 modified "2023-09-26" @default.
- W1550268524 title "Chapter 5 Consumables I: Slurry" @default.
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- W1550268524 doi "https://doi.org/10.1016/s0080-8784(08)62569-7" @default.
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