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- W1551169744 abstract "In this paper, the effect of Ni on the formation of Cu/sub 6/Sn/sub 5/ and Cu/sub 3/Sn intermetallics between tin and (Cu,Ni)-substrates has been studied by making use of the thermodynamic assessment of the Sn-Cu-Ni system. The driving forces for the diffusions of the elements in the intermetallic layers were calculated as functions of Ni-content. Assuming constant mobilities of elements, the results showed that all the diffusion fluxes in the (Cu,Ni)/sub 6/Sn/sub 5/ layer are increased with increasing dissolved Ni, while the dominant fluxes in the (Cu,Ni)/sub 3/Sn layer decrease. Therefore it is evident that Ni dissolution retards the growth of (Cu,Ni)/sub 3/Sn. When Ni-content of the substrate is high enough, (Cu,Ni)/sub 6/Sn/sub 5/ should be dominant in the reaction zones and the (Cu,Ni)/sub 3/Sn layer would disappear gradually. The shrinkage of (Cu,Ni)/sub 3/Sn is associated with larger difference between Sn and Cu fluxes in (Cu,Ni)/sub 3/Sn and therefore more extensive Kirkendall void formation. In addition, the calculated driving forces also suggest that the growth rate of (Cu,Ni)/sub 6/Sn/sub 5/ should further increase after the disappearance of (Cu,Ni)/sub 3/Sn resulting in an unusually thick (Cu,Ni)/sub 6/Sn/sub 5/ layer. The results of thermodynamic calculations supplemented with diffusion kinetic considerations are in good agreements with recent experimental observations." @default.
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- W1551169744 date "2006-07-10" @default.
- W1551169744 modified "2023-09-27" @default.
- W1551169744 title "Effect of Ni on the Formation of Cu6Sn5 and Cu3Sn Intermetallics" @default.
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- W1551169744 doi "https://doi.org/10.1109/ectc.2006.1645805" @default.
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