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• W1551279384 abstract "Different end-of-life mechanisms in power modules (i.e., solder fatigue and wire bond failures) and their interactions are subject of investigation. Their contribution to the lifetime limit is especially relevant for the extrapolation of accelerated endurance test results to application conditions. The comparison of Ag-diffusion sintered modules with traditional soldered modules allows investigating the influence of solder fatigue on the lifetime of power modules under active power cycling." @default.
• W1551279384 created "2016-06-24" @default.
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• W1551279384 date "2011-09-15" @default.
• W1551279384 modified "2023-09-24" @default.
• W1551279384 title "Impact of solder fatigue on module lifetime in power cycling tests" @default.
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