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- W1553553293 abstract "This paper discusses the fabrication of strained Si/strained SiGe/strained Si heterostructures on insulator by a bond and etch-back technique with total thickness of 25 nm. We have shown that the etch back process does not roughen the surface. By secondary ion mass spectroscopy (SIMS), we have shown a reduction in peak Ge fraction from the as grown 55% to 50% as a result of thermal processing." @default.
- W1553553293 created "2016-06-24" @default.
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- W1553553293 date "2005-03-07" @default.
- W1553553293 modified "2023-09-27" @default.
- W1553553293 title "Fabrication of strained Si/strained SiGe/strained Si heterostructures on insulator by a bond and etch-back technique" @default.
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- W1553553293 doi "https://doi.org/10.1109/soi.2004.1391544" @default.
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