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- W1557548325 abstract "LED Solid state lighting will become increasingly more important in the future, and high performance is required more. And new material and process is quite important for LED flip chip and wafer level LED packaging. This paper show new Japan material quick views for LED flip chip & wafer level packaging. - New Japan material & process introduction for LED high power flip chip & wafer level LED packaging; Insulation material Encapsulation material, Flip chip connection method, Plating technology." @default.
- W1557548325 created "2016-06-24" @default.
- W1557548325 creator A5052100762 @default.
- W1557548325 date "2014-10-01" @default.
- W1557548325 modified "2023-10-16" @default.
- W1557548325 title "New Japan material & process for LED flip chip + WL LED" @default.
- W1557548325 doi "https://doi.org/10.1109/impact.2014.7048359" @default.
- W1557548325 hasPublicationYear "2014" @default.
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