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- W1563214241 abstract "Microchannel heat sinks are a relevant thermal management technology because the combination of surface area enhancement and small length scales results in low wall-to-bulk temperature differences. Previously, a thermal resistance of 0.09°C/W was achieved when a heat flux of 790 W/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> was imposed on a 1 cm × 1 cm footprint portion of a 400-μm-thick Si substrate utilizing single-phase water-based microchannel cooling and a 214 kPa pressure difference to drive the flow. Galinstan, a gallium, indium, and tin eutectic, may be utilized for single-phase liquid metal cooling of microelectronics due to its subambient melting temperature and high thermal conductivity. This paper describes the fabrication and assembly of water-based microchannel and Galinstan-based minichannel heat sinks and the flow sheets utilized to characterize them under the aforementioned constraints. The prefix mini rather than micro is used to describe Galinstan-based heat sinks because optimal channel widths are hundreds as opposed to tens of micrometers. The aforementioned thermal resistance of 0.09 °C was experimentally reproduced. Unprecedentedly low thermal resistance and high heat flux in single-phase water-based microchannel cooling, i.e., 0.071°C/W and 1003 W/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> , respectively, were achieved. The first experimental data on Galinstan-based minichannel heat sinks are also reported. A thermal resistance as low as 0.077°C/W was achieved at a heat flux of 1214 W/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> and a maximum heat flux of 1504 W/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> was reached." @default.
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- W1563214241 date "2015-06-01" @default.
- W1563214241 modified "2023-10-06" @default.
- W1563214241 title "Water-Based Microchannel and Galinstan-Based Minichannel Cooling Beyond 1 kW/cm<inline-formula> <tex-math notation=LaTeX>$^{2}$ </tex-math></inline-formula> Heat Flux" @default.
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- W1563214241 doi "https://doi.org/10.1109/tcpmt.2015.2426791" @default.
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