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- W156395482 abstract "The current success of smartphones and the relentless trend to reduce cost and add capabilities every year are key drivers in the wireless semiconductor business. Combining various RF technologies into one device along with the desire for multi-site testing can easily increase the RF ATE test fixture port count to a range of 48 and beyond. While a few ATE vendors provide test equipment for this requirement, the question remains on how to manage the interfacing and the test fixture design for high density RF without losing performance. The current interfacing and layout paradigm will undergo a significant change. The RF connectors are moved further away from the DUT to allow easier assembly and debugging, but with higher risk of performance degradation due to loss, crosstalk and interference. This paper evaluates new hardware and layout techniques, discusses mechanical, performance and crosstalk requirements that need to be applied and describes the consequences this will have for loadboard design." @default.
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- W156395482 date "2009-01-01" @default.
- W156395482 modified "2023-09-27" @default.
- W156395482 title "High Density RF Loadboard Design" @default.
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