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• W1567170079 abstract "Using real-time voltage probing and circuit simulation, the stress induced by wafer-level CDM test methods is compared to that of package-level FICDM testers. It is shown that while wafer-level testers can replicate I/O failures, they may not replicate core failures because of differences in the induced current stress." @default.
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• W1567170079 date "2010-11-09" @default.
• W1567170079 modified "2023-09-28" @default.
• W1567170079 title "Investigation of current flow during wafer-level CDM using real-time probing" @default.
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• W1567170079 hasPublicationYear "2010" @default.
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