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- W1569366853 abstract "The high-speed electrical characteristics of a typical multilayer ceramic (MLC) package are described and a model presented. The tests were conducted in a realistic environment which closely models the surface mount environment for which the packages are intended. These MLC packages incorporate many of the same refinements used at the circuit-board level to improve high-speed performance, namely use of controlled impedance, 50 Omega , signal lines, multiple ground connections, and on-package power and ground planes. Using pulse reflection and transmission measurements as a diagnostic tool, it is shown how to develop a full SPICE model for a high-speed MLC package in a systems environment. A dominant electrical feature of the configuration is the ground plane discontinuity at the package-to-circuit board interface. This feature is prominent in the observed high-speed pulse response of the system. >" @default.
- W1569366853 created "2016-06-24" @default.
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- W1569366853 date "2002-12-04" @default.
- W1569366853 modified "2023-09-23" @default.
- W1569366853 title "High-speed characteristics of multilayer ceramic packages and test fixtures" @default.
- W1569366853 doi "https://doi.org/10.1109/gaas.1990.175487" @default.
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