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- W1569390557 abstract "A procedure for constructing the three-dimensional viscoelastic constitutive model of polymeric packaging material over a wide range of temperatures is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the viscoelastic constitutive behavior of a low-filler-percentage epoxy molding compound (EMC) was first characterized. Storage modulus mastercurves obtained from the DMA were converted to the relaxation moduli in the Laplace-Carson transform domain. The transformed Young's and shear relaxation moduli were then curve fitted by using an optimization procedure with restriction for ensuring physically admissible time-dependent Poisson's ratio. Bulk and shear relaxation moduli were then obtained from the fitted moduli and inverse transformed to the time domain. A numerical finite element model that considers the viscoelastic constitutive behavior of EMC was applied to simulate warpage of an overmolded flip-chip package under the surface mount solder reflow process and compared to experimental shadow Moire measurements for validating the constitutive model." @default.
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- W1569390557 date "2015-05-01" @default.
- W1569390557 modified "2023-09-23" @default.
- W1569390557 title "Development of a consistent multiaxial viscoelastic model for package warpage simulation" @default.
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- W1569390557 doi "https://doi.org/10.1109/ectc.2015.7159620" @default.
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