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• W1570260497 abstract "For the first time, low-k dielectric ALD-SiBN (atomic layer deposition) is successfully developed and applied on poly-Si/WSix gate as a spacer for reduction of parasitic capacitance between the cells. ALD-SiBN deposition is performed at 630/spl deg/C using dichlorosilane (SiH/sub 2/Cl/sub 2/-DCS), boron-trichloride (BCl/sub 3/) and ammonia (NH/sub 3/) as precursors. Compared with the conventional silicon nitride, ALD-SiBN exhibits similar film properties at lower dielectric constant. ALD-SiBN layer is deposited on poly-Si/WSix stack gate in 90nm NAND flash device. A significant reduction (>15%) of the floating-gate coupling voltage is achieved by employing SiBN compared with SiN spacer. In addition, excellent data retention characteristics (@HTS) is identified by applying low-k dielectric SiBN layer as a spacer on 90nm NAND flash device." @default.
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• W1570260497 date "2005-04-19" @default.
• W1570260497 modified "2023-09-22" @default.
• W1570260497 title "A highly manufacturable low-k ALD-SiBN process for 60nm NAND flash devices and beyond" @default.
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• W1570260497 doi "https://doi.org/10.1109/iedm.2004.1419380" @default.
• W1570260497 hasPublicationYear "2005" @default.
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