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- W1570896206 abstract "Great efforts have been invested by many equipment and assembly participants to overcome pitch-limited interconnection packaging technology by using advanced solutions like thermo-compression bonding (TB) which enable high placement accuracy and thin-wafer processability. In contrast, the use of conventional convection ovens to achieve high throughput reflow in chip scale packaging has been deemed suitable only for pitches below a certain value, with the exact threshold remaining vague depending on the operator's process and materials of choice. A key factor in this limitation is the choice of bump metallurgy used, thus solder bumps seems to reach a limit around 150-140-µm pitch vs. copper pillar, whose critical geometry is more definable during plating process, seems to be limited for mass reflow (MR) applications to a pitch around 100 µm." @default.
- W1570896206 created "2016-06-24" @default.
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- W1570896206 date "2015-05-01" @default.
- W1570896206 modified "2023-09-25" @default.
- W1570896206 title "Extending advanced interconnect technology to finer pitches with conventional mass reflow" @default.
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- W1570896206 doi "https://doi.org/10.1109/ectc.2015.7159633" @default.
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