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- W1576732068 abstract "Low temperature sintering is of vital importance for commercial production of electronic ce‐ ramics, especially multi-layer devices [1, 2]. Due to superior mechanical strength, ferroelec‐ tric ceramics with fine-grained structures have attracted much attention and exhibited potential applications such as piezoelectric sensors and actuators [3, 4-5]. Together, compo‐ site materials are also widely applied for multilayer capacitors, piezoelectric transducers, packaging materials for integrated circuits, high voltage insulators and chemical sensors [6-10]. It is well known that materials’ performances are closely related to the ways they are manufactured. Generally, ferroelectric ceramics fabrication process should achieve products of dense and homogeneous microstructure with well developed crystalline grains of uni‐ form size in order to ensure the best physical properties. Using conventional ceramic proc‐ ess to achieve such ideal microstructure, the window of sintering temperature required is always high and narrow. Conversely, the sintering temperature of sol-gel derived ceramics is always lower. However, the drawbacks of sol–gel method are aggregation of ultrafine powders during fabrication and formation of secondary phases [11]. Thus, the physical properties of these sol-gel derived ceramics are deteriorated in comparison to those of their counterparts. Recently, dense, crack-free ferroelectric thick film integrated on silicon sub‐ strate has been the subject of considerable attention for potential application in micro-elec‐ tro-mechanical systems (MEMS). Combining micro-machined surfaces of silicon wafers with ferroelectric films has resulted in novel devices such as micro-fluidic devices, micro-pumps, infrared sensors, dynamic random access memory, tunable microwave devices and several others [12-16]. Most of these ferroelectric thick film devices, such as multi-layer ceramic ca‐ pacitors (MLCC), require the film thickness to be around 1 micrometer. In addition, these" @default.
- W1576732068 created "2016-06-24" @default.
- W1576732068 creator A5053687490 @default.
- W1576732068 creator A5075455285 @default.
- W1576732068 creator A5083444994 @default.
- W1576732068 creator A5087912416 @default.
- W1576732068 date "2013-02-06" @default.
- W1576732068 modified "2023-10-16" @default.
- W1576732068 title "Low Temperature Hybrid Processing Technology of Fine Electronic Ceramics" @default.
- W1576732068 cites W1597523049 @default.
- W1576732068 cites W1664794257 @default.
- W1576732068 cites W1965598583 @default.
- W1576732068 cites W1973490767 @default.
- W1576732068 cites W1976205072 @default.
- W1576732068 cites W1982442001 @default.
- W1576732068 cites W2001472370 @default.
- W1576732068 cites W2003263957 @default.
- W1576732068 cites W2016397723 @default.
- W1576732068 cites W2027060397 @default.
- W1576732068 cites W2029857342 @default.
- W1576732068 cites W2035306541 @default.
- W1576732068 cites W2038728357 @default.
- W1576732068 cites W2041465350 @default.
- W1576732068 cites W2041923236 @default.
- W1576732068 cites W2042473989 @default.
- W1576732068 cites W2043357749 @default.
- W1576732068 cites W2059554039 @default.
- W1576732068 cites W2076167533 @default.
- W1576732068 cites W2079314491 @default.
- W1576732068 cites W2113289782 @default.
- W1576732068 cites W2151977713 @default.
- W1576732068 cites W3012380888 @default.
- W1576732068 cites W67001131 @default.
- W1576732068 doi "https://doi.org/10.5772/53255" @default.
- W1576732068 hasPublicationYear "2013" @default.
- W1576732068 type Work @default.
- W1576732068 sameAs 1576732068 @default.
- W1576732068 citedByCount "1" @default.
- W1576732068 countsByYear W15767320682016 @default.
- W1576732068 crossrefType "book-chapter" @default.
- W1576732068 hasAuthorship W1576732068A5053687490 @default.
- W1576732068 hasAuthorship W1576732068A5075455285 @default.
- W1576732068 hasAuthorship W1576732068A5083444994 @default.
- W1576732068 hasAuthorship W1576732068A5087912416 @default.
- W1576732068 hasBestOaLocation W15767320681 @default.
- W1576732068 hasConcept C127413603 @default.
- W1576732068 hasConcept C134132462 @default.
- W1576732068 hasConcept C159985019 @default.
- W1576732068 hasConcept C192562407 @default.
- W1576732068 hasConcept C49040817 @default.
- W1576732068 hasConcept C61696701 @default.
- W1576732068 hasConceptScore W1576732068C127413603 @default.
- W1576732068 hasConceptScore W1576732068C134132462 @default.
- W1576732068 hasConceptScore W1576732068C159985019 @default.
- W1576732068 hasConceptScore W1576732068C192562407 @default.
- W1576732068 hasConceptScore W1576732068C49040817 @default.
- W1576732068 hasConceptScore W1576732068C61696701 @default.
- W1576732068 hasLocation W15767320681 @default.
- W1576732068 hasLocation W15767320682 @default.
- W1576732068 hasOpenAccess W1576732068 @default.
- W1576732068 hasPrimaryLocation W15767320681 @default.
- W1576732068 hasRelatedWork W1515141332 @default.
- W1576732068 hasRelatedWork W2026142536 @default.
- W1576732068 hasRelatedWork W2319304759 @default.
- W1576732068 hasRelatedWork W2364319454 @default.
- W1576732068 hasRelatedWork W2367728600 @default.
- W1576732068 hasRelatedWork W2371468566 @default.
- W1576732068 hasRelatedWork W2805770379 @default.
- W1576732068 hasRelatedWork W3133714753 @default.
- W1576732068 hasRelatedWork W3160043956 @default.
- W1576732068 hasRelatedWork W4231943995 @default.
- W1576732068 isParatext "false" @default.
- W1576732068 isRetracted "false" @default.
- W1576732068 magId "1576732068" @default.
- W1576732068 workType "book-chapter" @default.