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- W1577791357 abstract "Multilayer substrates such as interposers and printed circuit boards (PCBs) are basic interconnect technologies in modern and next-generation systems in which chip, package and board have been used as constructing elements. Consequently, multilayer substrates have been intensively studied in worldly dispersed electronics packaging research centers in which questions related to how to improve electrical, mechanical, thermal and reliable performances are on the agenda. Moreover, interconnection items affect directly on miniaturization, integration, cost-effectiveness and electrical characteristics of electronics components and, as a result, on promotion of electronics products to the market." @default.
- W1577791357 created "2016-06-24" @default.
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- W1577791357 date "2010-04-01" @default.
- W1577791357 modified "2023-09-27" @default.
- W1577791357 title "Vertical Transmission Lines in Multilayer Substrates and Highly-Integrated Filtering Components Based on These Transmission Lines" @default.
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- W1577791357 doi "https://doi.org/10.5772/9411" @default.
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