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- W1585957519 abstract "In this work we investigate the correlation between the resistance behaviour and the mass transport in narrow line interconnects with a laminated structure incorporating multiple layers of Ti in Al-Si. For comparison, homogeneous Al-Si films are also studied. The electromigration resistance is evaluated by applying a temperature-ramp resistance analysis (TRACE) at direct wafer level. The improved stability against electromigration in the laminated structures is related to the formation of a continuous barrier of the intermetallic compound TiAl 3 , preventing voids from propagating across the film." @default.
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- W1585957519 date "1987-09-01" @default.
- W1585957519 modified "2023-09-22" @default.
- W1585957519 title "Electrical and Structural Characterization of Electromigration in Al-Si/Ti Multilayer Interconnects" @default.
- W1585957519 hasPublicationYear "1987" @default.
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