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• W1591793958 abstract "Based on physically-extended methodology, measurements and simulations show that implementing high-mobility materials and particularly alloys, such as a SiGe buffer for mobility enhancement in a Ge channel, can result in a 115% increase in self heating in the N7 node, compared to standard Si FinFETs." @default.
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• W1591793958 date "2015-06-01" @default.
• W1591793958 modified "2023-10-01" @default.
• W1591793958 title "Characterization of self-heating in high-mobility Ge FinFET pMOS devices" @default.
• W1591793958 cites W2056011546 @default.
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• W1591793958 doi "https://doi.org/10.1109/vlsit.2015.7223703" @default.
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