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- W1606150 abstract "A method for evaluating fatigue life of the bonding wires in semiconductor packages under a temperature cycling test was studied analytically using a finite element method based on design of experiments. The sensitivity analysis of the maximum strain occurs in a bonding wire was carried out to make clear the effect of the loop-shape of the wire on the strain. It was found that we can evaluate the fatigue life of a bonding wire under various conditions of a temperature cycling test at the early stage of design by using both the Chebyshev function of a loop, shape factor and the Manson-Coffin fatigue life curve. It was also found that highly reliable loop shape of the wire can be designed by minimizing the strain using design of experiments." @default.
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- W1606150 date "2004-01-01" @default.
- W1606150 modified "2023-09-24" @default.
- W1606150 title "Optimization of Loop-shape of a Bonding Wire using Design of Experiments" @default.
- W1606150 doi "https://doi.org/10.1299/jsmemecjo.2004.6.0_49" @default.
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