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- W1607765749 abstract "A test flow using a auto repair technique has also been proposed. It assumes a conventional wafer testing, but puts much weight on the post-package test by utilizing the proposed auto repair technique. This is implemented in a 36 Mb embedded DRAM macro of 6ns cycle time. It consists of internal compare circuit, redundancy analyzer, and anti-fuses. The internal auto programming of anti-fuse fixes post-packaging failures that might appear by final at-speed test and contributes to yield improvement." @default.
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- W1607765749 date "2005-03-21" @default.
- W1607765749 modified "2023-09-25" @default.
- W1607765749 title "Post-packaging auto repair techniques for fast row cycle embedded DRAM" @default.
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- W1607765749 doi "https://doi.org/10.1109/test.2004.1387367" @default.
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