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- W161632817 abstract "This chapter discusses the evaluation of thermal shock and thermal resistance of three reaction-bonded silicon carbide ceramics. It discusses a methodology and its various stages to characterize the thermal shock and thermal fatigue strengths applied to test specimens in the case of quick cooling by air. This method is developed according to a local mechanical approach based on a description of the thermal and stress fields in the specimen and on the effect of defects by means of the stress intensity factor. The geometry selected for the test sample is a thin disc. The thermal shock is a downshock generated by air cooling on the circumference of a heated disc. This induces thermal stresses in this test specimen due to the inner temperature gradient. The higher stresses are the tangential tensile ones near the periphery. If any critical defect is present in this area, then fracture in an opening mode may appear and a crack may propagate perpendicularly to the disc edges. Cracking is detected in situ by acoustic emission, a non-destructive control technique." @default.
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- W161632817 date "1994-01-01" @default.
- W161632817 modified "2023-09-25" @default.
- W161632817 title "EVALUATION OF THERMAL SHOCK AND THERMAL RESISTANCE OF THREE REACTION BONDED SILICON CARBIDE CERAMICS" @default.
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- W161632817 doi "https://doi.org/10.1016/b978-0-08-042133-9.50025-3" @default.
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