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- W1618974277 abstract "The effect of line scaling on Cu grain structures has been investigated by using both plan‐view and cross‐sectional transmission electron microscopy (TEM) techniques. Cu damascene lines with three different line widths of 850, 185 and 60 nm were studied. The plan‐view TEM images revealed that the 850 nm lines had both polycrystalline and bamboo‐like grain structures, whereas the 185 and the 60 nm lines had near bamboo‐like structures. Statistical analysis was performed on the grain size distributions for both 185 nm and 60 nm lines. The results showed that the 185 nm lines followed a normal grain growth behavior, while the 60 nm lines deviated from normal grain growth with excessive small grains at the lower percentile which was attributed to scaling‐induced small grain growth. Further analysis by cross‐sectional TEM along the Cu trench line direction revealed that the 850 nm lines had bamboo‐like structures across the thickness while the 185 nm and the 60 nm lines showed a combination of bamboo‐like and multigrain structures with small grain clusters concentrated at the trench bottom." @default.
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- W1618974277 date "2009-01-01" @default.
- W1618974277 modified "2023-10-16" @default.
- W1618974277 title "Line Scaling Effect on Grain Structure for Cu Interconnects" @default.
- W1618974277 doi "https://doi.org/10.1063/1.3169254" @default.
- W1618974277 hasPublicationYear "2009" @default.
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