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- W1621396997 abstract "As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink" @default.
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- W1621396997 date "2005-06-28" @default.
- W1621396997 modified "2023-09-22" @default.
- W1621396997 title "Thermal performance of water-cooled heat sinks" @default.
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- W1621396997 doi "https://doi.org/10.1109/apec.2005.1452902" @default.
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