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- W1628199696 abstract "Abstract : Methods for measurement of thermal resistance and response curves, including MIL-STD-883 Method 1012, were evaluated to determine an optimum method to measure MIL-M-38510 packages. Computer simulation, IR and electrical measurements were evaluated and compared for special thermal test packages. A ratio of about 5:1 was shown to exist for the junction peak, average and region temperature rise. Measurements can be misleading without proper interpretation. The optimum method, IR measurement of a coated chip, can measure only the junction region thermal resistance." @default.
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- W1628199696 date "1975-08-01" @default.
- W1628199696 modified "2023-09-23" @default.
- W1628199696 title "Thermal Resistance of Microelectronic Packages. Part 1. Recommended Method 1012 (Thermal Characteristics) for MIL-STD-883. Part 2. Summary of Analyses and Experimental Data for Thermal Test Packages and MIL-M-38510 Packages." @default.
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