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- W1628295321 abstract "An Al-interconnect/Cu-plug structure, whereby a plug is filled by electrochemical deposition (ECD) for FeRAM interconnection, has been developed. Conventionally sputtered Al for current FeRAM devices cannot fill high aspect ratio plugs. A high aspect ratio plug can successfully be filled by ECD Cu and PZT degradation with this structure is much less than that with an Al-interconnect/W-plug structure, which has been widely adopted for DRAM and logic devices." @default.
- W1628295321 created "2016-06-24" @default.
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- W1628295321 date "2003-01-20" @default.
- W1628295321 modified "2023-09-23" @default.
- W1628295321 title "Al-interconnect/Cu-plug structure for FeRAM multilevel interconnect" @default.
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- W1628295321 doi "https://doi.org/10.1109/vlsit.1999.799384" @default.
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