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- W1634414114 abstract "It is shown that the use of thermal substrates in high-performance microwave devices makes it possible to minimize parasitic inductance, ensure excellent thermal conduction and high reliability, yield maximum circuit density, and eliminate metal cans. The design of a thermal substrate (Al{sub 2}O{sub 3}, AlN, BeO) with via holes is described, and the electrical characteristics of a thin-film pattern fabricated on a polished 15-mil alumina thermal substrate are presented. It is shown that thermal resistance of via hole substrates is at least 50 percent lower compared to that of alumina in the particular configuration tested. 8 refs." @default.
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- W1634414114 date "1990-10-01" @default.
- W1634414114 modified "2023-09-28" @default.
- W1634414114 title "Thermal substrates - A new microwave substrate technology for thermal management and low parasitic elements" @default.
- W1634414114 hasPublicationYear "1990" @default.
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