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- W1638961292 abstract "Solder joint geometry can affect the lifetimes of electronic packages as a consequence of the strains which build up as a result of temperature changes. The aim of the work reported in this paper is two fold: (i) to show how small changes in shape, e.g. asymmetry and joint curvature, arising from small differences in manufacturing ball grid arrays (BGAs) can affect the resulting thermal strains and hence joint lifetimes; (ii) to investigate the effect on projected joint lifetimes on changing the heights of the solder joints in column grid arrays (CGAs). Damage occurs during thermal cycling due to the large thermal expansion mismatch between the various materials used in circuit boards and packages. The resulting thermal strains and stresses can be predicted using 2-D finite element analysis. Joint lifetime is then estimated from the maximum creep strain range and stress range using phenomenological damage equations which have been derived empirically." @default.
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- W1638961292 date "1998-01-01" @default.
- W1638961292 modified "2023-09-26" @default.
- W1638961292 title "The Effect of Solder Joint Geometry on Electronic Package Reliability" @default.
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