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- W1641314472 endingPage "838" @default.
- W1641314472 startingPage "833" @default.
- W1641314472 abstract "The Single Edge Contact (S.E.C.) cartridge is Intel's innovative packaging design which enables high performance to be delivered to mainstream systems. Using this technology, the core and L2 cache are fully enclosed in a metal and plastic cartridge. These sub-components are surface mounted directly to a substrate inside the cartridge to enable high-frequency operation. The S.E.C. cartridge technology allows the use of widely available and high-performance industry burst pipeline synchronous static RAM memories for the dedicated L2 cache to enable high-performance processing. These SRAM's are packaged in Thin Quad Flat Pack (TQFP) packages which usually are designed to operate in an environment ranging between room temperature and 45 °C However, the local ambient temperature surrounding the TQFP inside the S.E.C. cartridge is typically higher than 45 °C and the processor substrate inside the S.E.C. cartridge is hot due to the heat generated from the core package. This causes the TQFP operation temperature to be significantly higher than the usual application. A test vehicle assembled with thermal test chips and the S.E.C. cartridge enclosure was used to investigate the TQFP temperature inside the S.E.C. cartridge under different power assumption scenarios. The thermal measurement results indicate that the thermal coupling between TQFP and the thermal plate is not required when the total power of the four SRAM's is less than 2.3 Watts. However, further increase of SRAM power dissipation requires thermal coupling between the TQFP's and the thermal plate to maintain the appropriate junction temperature. This paper will discuss several different approaches to lower the TQFP temperature by thermally coupling the TQFP packages to the thermal plate or back cover. These approaches can be implemented for the SRAM total power greater than 2.3 Watts. The total power dissipation limits for the TQFP package under different heat sinking methods is also discussed in this paper." @default.
- W1641314472 created "2016-06-24" @default.
- W1641314472 creator A5001088666 @default.
- W1641314472 creator A5034702405 @default.
- W1641314472 creator A5059753913 @default.
- W1641314472 date "1998-01-01" @default.
- W1641314472 modified "2023-09-24" @default.
- W1641314472 title "Pentium® II Processor Packaging - Thermal Management of SRAM's in a S.E.C. Cartridge" @default.
- W1641314472 hasPublicationYear "1998" @default.
- W1641314472 type Work @default.
- W1641314472 sameAs 1641314472 @default.
- W1641314472 citedByCount "2" @default.
- W1641314472 crossrefType "journal-article" @default.
- W1641314472 hasAuthorship W1641314472A5001088666 @default.
- W1641314472 hasAuthorship W1641314472A5034702405 @default.
- W1641314472 hasAuthorship W1641314472A5059753913 @default.
- W1641314472 hasConcept C116915560 @default.
- W1641314472 hasConcept C119599485 @default.
- W1641314472 hasConcept C121332964 @default.
- W1641314472 hasConcept C127413603 @default.
- W1641314472 hasConcept C153294291 @default.
- W1641314472 hasConcept C192562407 @default.
- W1641314472 hasConcept C204530211 @default.
- W1641314472 hasConcept C24326235 @default.
- W1641314472 hasConcept C34381374 @default.
- W1641314472 hasConcept C68043766 @default.
- W1641314472 hasConcept C78519656 @default.
- W1641314472 hasConcept C98375054 @default.
- W1641314472 hasConceptScore W1641314472C116915560 @default.
- W1641314472 hasConceptScore W1641314472C119599485 @default.
- W1641314472 hasConceptScore W1641314472C121332964 @default.
- W1641314472 hasConceptScore W1641314472C127413603 @default.
- W1641314472 hasConceptScore W1641314472C153294291 @default.
- W1641314472 hasConceptScore W1641314472C192562407 @default.
- W1641314472 hasConceptScore W1641314472C204530211 @default.
- W1641314472 hasConceptScore W1641314472C24326235 @default.
- W1641314472 hasConceptScore W1641314472C34381374 @default.
- W1641314472 hasConceptScore W1641314472C68043766 @default.
- W1641314472 hasConceptScore W1641314472C78519656 @default.
- W1641314472 hasConceptScore W1641314472C98375054 @default.
- W1641314472 hasLocation W16413144721 @default.
- W1641314472 hasOpenAccess W1641314472 @default.
- W1641314472 hasPrimaryLocation W16413144721 @default.
- W1641314472 hasRelatedWork W1485036283 @default.
- W1641314472 hasRelatedWork W15048860 @default.
- W1641314472 hasRelatedWork W1601115810 @default.
- W1641314472 hasRelatedWork W1653248002 @default.
- W1641314472 hasRelatedWork W1660506471 @default.
- W1641314472 hasRelatedWork W1893995322 @default.
- W1641314472 hasRelatedWork W1973260801 @default.
- W1641314472 hasRelatedWork W2094512296 @default.
- W1641314472 hasRelatedWork W2096012515 @default.
- W1641314472 hasRelatedWork W2113532997 @default.
- W1641314472 hasRelatedWork W2133119509 @default.
- W1641314472 hasRelatedWork W2133333632 @default.
- W1641314472 hasRelatedWork W2134860081 @default.
- W1641314472 hasRelatedWork W2137325909 @default.
- W1641314472 hasRelatedWork W2140118625 @default.
- W1641314472 hasRelatedWork W2143832745 @default.
- W1641314472 hasRelatedWork W2150328878 @default.
- W1641314472 hasRelatedWork W2786220120 @default.
- W1641314472 hasRelatedWork W2970549418 @default.
- W1641314472 hasRelatedWork W3190304713 @default.
- W1641314472 hasVolume "3582" @default.
- W1641314472 isParatext "false" @default.
- W1641314472 isRetracted "false" @default.
- W1641314472 magId "1641314472" @default.
- W1641314472 workType "article" @default.