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- W1645539095 abstract "A high-reliability double-metal process is described that overcomes many of the reliability problems encountered with Al alloy films. The metallization utilizes a multilayer metal consisting of Al-1% Cu sandwiched between two TiW films. The contact resistance to both N/sup +/ and P/sup +/ are the lowest possible to both diffusions for any metallizations. As a result, contact resistance is not the limiting factor to device performance for either P-channel or N-channel devices. The current-carrying capability of both levels of metals is at least a factor of three higher than Al-Si alloys over flat areas and an order higher from via chains. The metallization is robust enough to sustain thermal and mechanical stresses without failure. >" @default.
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- W1645539095 date "2003-01-06" @default.
- W1645539095 modified "2023-09-26" @default.
- W1645539095 title "A high reliability metallization system for a double metal 1.5 mu m CMOS process" @default.
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- W1645539095 doi "https://doi.org/10.1109/vmic.1988.14225" @default.
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