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- W1652847597 abstract "The technology and economics of four methods of wafering silicon boules of large cross section are described. Slurry sawing using either blades or wires, and fixed abrasive sawing using the ID saw or by the FAST method, having the abrasive attached to wires which are arranged in a blade pack, are considered. The technical performance of each method is evaluated and cost/price estimates are summarized." @default.
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- W1652847597 date "1982-02-01" @default.
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- W1652847597 title "Comparison of various silicon sawing methods" @default.
- W1652847597 hasPublicationYear "1982" @default.
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