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- W1665764915 abstract "The more shrinkage of device patterns becomes, the more device patterns, themselves, can be damaged by collisions between particles and wafers which moves very fast on batch‐type implanters. The measures against this problem are to decrease the particles source, not to reach at the wafers, and to prevent the damage to device patterns by reducing the disk rotation speed. As a result, this method is extremely effective to minimize the yield loss without any faults." @default.
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- W1665764915 date "2006-01-01" @default.
- W1665764915 modified "2023-10-16" @default.
- W1665764915 title "Reduction of the Wafer Pattern Damage on the Batch-type High Current Ion Implanters" @default.
- W1665764915 doi "https://doi.org/10.1063/1.2401555" @default.
- W1665764915 hasPublicationYear "2006" @default.
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