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- W167396845 abstract "The importance of heat diffusion manifests itself in connection with heat removal from plastic packaging of active semiconductors devices. The effective thermal conductivity λeff(C) and the adiabatic bulk modulus Keff(C) of an epoxy resin (λr = 0.186 W/mK; Kr = 6.01 GPa) has been measured versus the volume loading ratio (hereafter Vr) C (0 to 0.7) of crystalline quartz (λf = 14 W/mK; Kf = 57 GPa) and fused quartz (λf = 1.4 W/mK; Kf = 37 GPa). Experimental data on boron nitride and aluminum nitride have already been published [1,2]. Effective medium approximations, percolation or lowermost and uppermost limits of Hashin-Shtrikman (H-S) [3] or Milton [4] are all classical models to predict λeff or Keff of particulate filled plastics (hereafter PFP). Parameter fitting is generally required except for the H-S bounds." @default.
- W167396845 created "2016-06-24" @default.
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- W167396845 date "1993-01-01" @default.
- W167396845 modified "2023-09-27" @default.
- W167396845 title "Relationship Between the Thermal Conductivity and the Adiabatic Bulk Modulus of Epoxy Resins Loaded with Ceramic Particles" @default.
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- W167396845 doi "https://doi.org/10.1007/978-3-642-84888-9_19" @default.
- W167396845 hasPublicationYear "1993" @default.
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