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- W1694445139 abstract "A new conductive polymer flip-chip bonding technique has been developed and characterized using micromachined conductive polymer bumps. By using UV-based photolithography with thick photoresists, molds for the flip-chip bumps have been patterned, filled with conductive polymers, selectively cured, and then stripped, leaving molded conductive polymer bumps on contact metal pads. After flip-chip bonding with the micromachined conductive polymer bumps, the contact resistances measured for 25 /spl mu/m-high bumps with 300 /spl mu/m/spl times/300 /spl mu/m area and 400 /spl mu/m/spl times/400 /spl mu/m area were 35 m/spl Omega/ and 12 m/spl Omega/, respectively. The conductive polymer flip-chip bonding technique developed in this work showed a very low contact resistance, simple processing steps, a high bumping alignment resolution (</spl plusmn/5 /spl mu/m), and a lower bonding temperature (/spl sim/170/spl deg/C)." @default.
- W1694445139 created "2016-06-24" @default.
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- W1694445139 date "2002-11-27" @default.
- W1694445139 modified "2023-09-26" @default.
- W1694445139 title "Flip-chip packaging with micromachined conductive polymer bumps" @default.
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- W1694445139 doi "https://doi.org/10.1109/adhes.1998.742031" @default.
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