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- W1717968844 abstract "In order to increase the toughness of the bonding, a thin metal layer is introduced near the interface created by wafer bonding. A theoretical study of the influence of this metal interlayer on the toughness of the bonding was undertaken." @default.
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- W1717968844 date "2005-01-01" @default.
- W1717968844 modified "2023-09-27" @default.
- W1717968844 title "Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding" @default.
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