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- W1727847349 abstract "An advanced endpoint detection system, the EndPoint Plus/sup TM/ (EPP/sup TM/) from Lam Research Corporation, has recently been optimized and proven in production on Rainbow/sup TM/ 4520 oxide etchers at IBM Microelectronics in Essex Junction, Vermont. This paper discusses the endpoint detection and control system used on wafers with exposed etch areas ranging from 0.5% to 15%. The system correctly identified endpoint despite modern semiconductor fabrication requirements that make detection difficult. Evaluation showed that using automated endpoint detection and control increased throughput and reduced rework across a wide range of etch applications in volume manufacturing." @default.
- W1727847349 created "2016-06-24" @default.
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- W1727847349 date "2002-12-24" @default.
- W1727847349 modified "2023-09-27" @default.
- W1727847349 title "An advanced endpoint solution for >1% open area applications; contact and via" @default.
- W1727847349 doi "https://doi.org/10.1109/asmc.1996.558094" @default.
- W1727847349 hasPublicationYear "2002" @default.
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