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• W173548140 abstract "This paper presents methods of measuring temperature rises due to in-circuit testing in bond wires and the output transistors of digital integrated circuits. Bond wire temperature changes were measured by using the wire itself as a temperature sensor. The measurement of junction heating has been carried out with three different sensors on the die each giving different information about the source temperature distribution. Potential sources of damage due to these temperature rises are identified and an experimental technique is given to observe one of these mechanisms. Junction temperature measurement techniques, which are usable on most digital integrated circuits, allow measurements to be made in the submicrosecond time frame where much of the temperature rise takes place." @default.
• W173548140 created "2016-06-24" @default.
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• W173548140 date "1984-10-16" @default.
• W173548140 modified "2023-09-23" @default.
• W173548140 title "Measuring thermal rises due to digital device overdriving" @default.
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