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- W1745677428 abstract "Flexible polymer memory devices were fabricated based on 4,4′-(hexafluoroisopropylidene)diphthalic anhydride-4,4′-oxydianiline (6FDA-ODA) polyimide (PI)/Cu2O nanocomposite via chemical curing, heat treatment, and post-heat treatment at low temperature (<200 °C). Following the deposition of a Cu bottom electrode on a commercial PI film substrate, a PI precursor, polyamic acid (PAA) was spin-coated onto the Cu bottom electrode, and Cu was dissolved into the PAA, providing Cu ions for particle formation. The 6FDA-ODA PAA–Cu complex was imidized via chemical curing using acetic anhydride and triethylamine at 50 °C, and thermal treatment was performed at 200 °C in a reducing atmosphere to remove the solvent completely and precipitate Cu nanoparticles. Post-heat treatment was sequentially carried out at 150 °C in an oxidizing atmosphere to oxidize Cu to Cu2O. The Al top electrode was deposited onto the 6FDA-ODA PI/Cu2O nanocomposite film, and the flexible memory device with a crossbar array showed an ON/OFF ratio of ∼104, endurance of 60 cycles, retention time of 104 s, and device yield of 86% (31 cells out of total 36 cells) under flat and bending conditions (bending radius ∼1.5 mm) when the electrical measurements were performed in air at room temperature." @default.
- W1745677428 created "2016-06-24" @default.
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- W1745677428 date "2015-12-01" @default.
- W1745677428 modified "2023-09-24" @default.
- W1745677428 title "The formation of Cu2O nanoparticles in polyimide using Cu electrodes via chemical curing, and their application in flexible polymer memory devices" @default.
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- W1745677428 doi "https://doi.org/10.1016/j.orgel.2015.09.007" @default.
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