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• W1761963164 abstract "Soft‐ and reactive landing of mass‐selected ions is gaining attention as a promising approach for the precisely‐controlled preparation of materials on surfaces that are not amenable to deposition using conventional methods. A broad range of ionization sources and mass filters are available that make ion soft‐landing a versatile tool for surface modification using beams of hyperthermal (<100 eV) ions. The ability to select the mass‐to‐charge ratio of the ion, its kinetic energy and charge state, along with precise control of the size, shape, and position of the ion beam on the deposition target distinguishes ion soft landing from other surface modification techniques. Soft‐ and reactive landing have been used to prepare interfaces for practical applications as well as precisely‐defined model surfaces for fundamental investigations in chemistry, physics, and materials science. For instance, soft‐ and reactive landing have been applied to study the surface chemistry of ions isolated in the gas‐phase, prepare arrays of proteins for high‐throughput biological screening, produce novel carbon‐based and polymer materials, enrich the secondary structure of peptides and the chirality of organic molecules, immobilize electrochemically‐active proteins and organometallics on electrodes, create thin films of complex molecules, and immobilize catalytically active organometallics as well as ligated metal clusters. In addition, soft landing has enabled investigation of the size‐dependent behavior of bare metal clusters in the critical subnanometer size regime where chemical and physical properties do not scale predictably with size. The morphology, aggregation, and immobilization of larger bare metal nanoparticles, which are directly relevant to the design of catalysts as well as improved memory and electronic devices, have also been studied using ion soft landing. This review article begins in section 1 with a brief introduction to the existing applications of ion soft‐ and reactive landing. Section 2 provides an overview of the ionization sources and mass filters that have been used to date for soft landing of mass‐selected ions. A discussion of the competing processes that occur during ion deposition as well as the types of ions and surfaces that have been investigated follows in section 3. Section 4 discusses the physical phenomena that occur during and after ion soft landing, including retention and reduction of ionic charge along with factors that impact the efficiency of ion deposition. The influence of soft landing on the secondary structure and biological activity of complex ions is addressed in section 5. Lastly, an overview of the structure and mobility as well as the catalytic, optical, magnetic, and redox properties of bare ionic clusters and nanoparticles deposited onto surfaces is presented in section 6. © 2015 Wiley Periodicals, Inc. Mass Spec Rev 35:439–479, 2016." @default.
• W1761963164 created "2016-06-24" @default.
• W1761963164 creator A5053236615 @default.
• W1761963164 creator A5067221546 @default.
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• W1761963164 date "2015-04-16" @default.
• W1761963164 modified "2023-10-16" @default.
• W1761963164 title "Soft‐ and reactive landing of ions onto surfaces: Concepts and applications" @default.
• W1761963164 cites W112465128 @default.
• W1761963164 cites W1497607425 @default.
• W1761963164 cites W1524673917 @default.
• W1761963164 cites W1566750614 @default.
• W1761963164 cites W1858124427 @default.
• W1761963164 cites W1964850705 @default.
• W1761963164 cites W1964898857 @default.
• W1761963164 cites W1966942617 @default.
• W1761963164 cites W1967588055 @default.
• W1761963164 cites W1968656441 @default.
• W1761963164 cites W1969523090 @default.
• W1761963164 cites W1970007491 @default.
• W1761963164 cites W1970471856 @default.
• W1761963164 cites W1971801603 @default.
• W1761963164 cites W1972574633 @default.
• W1761963164 cites W1973020099 @default.
• W1761963164 cites W1974303993 @default.
• W1761963164 cites W1975685722 @default.
• W1761963164 cites W1975726026 @default.
• W1761963164 cites W1976472498 @default.
• W1761963164 cites W1976634541 @default.
• W1761963164 cites W1976870443 @default.
• W1761963164 cites W1976983464 @default.
• W1761963164 cites W1977128958 @default.
• W1761963164 cites W1978027492 @default.
• W1761963164 cites W1979541519 @default.
• W1761963164 cites W1980187728 @default.
• W1761963164 cites W1980807995 @default.
• W1761963164 cites W1982507235 @default.
• W1761963164 cites W1982766804 @default.
• W1761963164 cites W1983199386 @default.
• W1761963164 cites W1984265375 @default.
• W1761963164 cites W1985252173 @default.
• W1761963164 cites W1986528861 @default.
• W1761963164 cites W1986719312 @default.
• W1761963164 cites W1987578689 @default.
• W1761963164 cites W1989031761 @default.
• W1761963164 cites W1989276305 @default.
• W1761963164 cites W1989529895 @default.
• W1761963164 cites W1989839213 @default.
• W1761963164 cites W1990503150 @default.
• W1761963164 cites W1991705879 @default.
• W1761963164 cites W1992246384 @default.
• W1761963164 cites W1992514326 @default.
• W1761963164 cites W1993092350 @default.
• W1761963164 cites W1993775339 @default.
• W1761963164 cites W1994181351 @default.
• W1761963164 cites W1994315338 @default.
• W1761963164 cites W1994854514 @default.
• W1761963164 cites W1995016498 @default.
• W1761963164 cites W1996194621 @default.
• W1761963164 cites W1996531769 @default.
• W1761963164 cites W1996715639 @default.
• W1761963164 cites W1997018173 @default.
• W1761963164 cites W1997374000 @default.
• W1761963164 cites W1997390901 @default.
• W1761963164 cites W1997464170 @default.
• W1761963164 cites W1997841314 @default.
• W1761963164 cites W1998177827 @default.
• W1761963164 cites W1999445526 @default.
• W1761963164 cites W1999691736 @default.
• W1761963164 cites W2000358567 @default.
• W1761963164 cites W2000921397 @default.
• W1761963164 cites W2001399588 @default.
• W1761963164 cites W2001779402 @default.
• W1761963164 cites W2002734549 @default.
• W1761963164 cites W2003249955 @default.
• W1761963164 cites W2004573704 @default.
• W1761963164 cites W2004937253 @default.
• W1761963164 cites W2005526599 @default.
• W1761963164 cites W2006301489 @default.
• W1761963164 cites W2008139661 @default.
• W1761963164 cites W2008310110 @default.
• W1761963164 cites W2008879327 @default.
• W1761963164 cites W2009289812 @default.
• W1761963164 cites W2009482474 @default.
• W1761963164 cites W2010912461 @default.
• W1761963164 cites W2014989127 @default.
• W1761963164 cites W2015486755 @default.
• W1761963164 cites W2016138428 @default.
• W1761963164 cites W2016300615 @default.
• W1761963164 cites W2016981597 @default.
• W1761963164 cites W2017537233 @default.
• W1761963164 cites W2018573973 @default.
• W1761963164 cites W2018711518 @default.
• W1761963164 cites W2019158390 @default.
• W1761963164 cites W2019318834 @default.
• W1761963164 cites W2019755232 @default.
• W1761963164 cites W2020305553 @default.
• W1761963164 cites W2020472043 @default.

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