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- W177220701 endingPage "189" @default.
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- W177220701 abstract "Copper deposition in the presence of an organic additive (3-mercaptopropionic acid, MPA) was studied by cyclic voltammetry and in situ scanning tunneling microscopy (STM) and the results are compared to those for additive-free solutions. It is shown that underpotential deposition (upd) of copper onto a fully MPA-covered electrode produces a defect-rich substrate, but the defects are blocked by the dense organic film for bulk deposition, resulting in a low number of nuclei. A grain-refining effect of MPA, however, was found, when Cu deposition was initiated shortly after addition of MPA to the solution, i.e., for a low-coverage MPA adlayer." @default.
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- W177220701 date "2003-12-01" @default.
- W177220701 modified "2023-10-03" @default.
- W177220701 title "Adsorption of mercaptopropionic acid onto Au(1 1 1)" @default.
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- W177220701 doi "https://doi.org/10.1016/j.electacta.2003.07.011" @default.
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