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- W1786717966 abstract "The rubbery (equilibrium) modulus of thermosetting polymers dominates the mechanical behavior at elevated temperature or at long times. It also plays a major role in the residual stress induced during the curing process. In this paper, ai extensive study on the cure-dependent rubbery moduli of silica spheres filled epoxy resin is carried out both experimentally and theoretically. DSC measurements were used for characterization of the cure kinetics and T/sub g/-conversion relationship. Low frequency DMA was used to measure the rubbery modulus build-up during cure. A model based on scaling analysis was applied to describe the evolution of the rubbery shear modulus. A similar model was proposed for the cure-dependent rubbery bulk modulus. Models from the theory of particulate-filled composites were used to predict the rubbery moduli of the molding compound with different filler concentration. The effect of the filler percentage on the rubbery moduli was discussed." @default.
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- W1786717966 date "2005-09-09" @default.
- W1786717966 modified "2023-09-26" @default.
- W1786717966 title "Measuring and modeling the cure -dependent rubbery moduli of epoxy molding compound" @default.
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- W1786717966 doi "https://doi.org/10.1109/esime.2005.1502785" @default.
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