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- W179594803 abstract "Publisher Summary This chapter discusses electromigration in interconnects and contacts. The term electromigration refers to the current-induced displacement of atoms that occurs in a conductive material maintained at an elevated temperature and through which current is passed. The majority of the experimental results for electromigration in fine lines suggest that the primary consideration for evaluating accelerated test results is the electric field-driven convective term in the overall continuity equation. Comparatively few experimental results are available presently that have studied this phenomenon compared to electromigration in lines. The chapter also discusses accelerated testing. It also describes electromigration test techniques for fine lines, and presents recent developments using transient resistance measurements. The improvements in electromigration resistance can be accomplished by the addition of dopants, control of the film microstructure, and the presence of dielectric overlayers. These improvements are marked by either higher activation energies or longer meantime to failure." @default.
- W179594803 created "2016-06-24" @default.
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- W179594803 date "1987-01-01" @default.
- W179594803 modified "2023-09-25" @default.
- W179594803 title "Electromigration in Interconnects and Contacts" @default.
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- W179594803 doi "https://doi.org/10.1016/b978-0-12-234115-1.50012-x" @default.
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