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- W182969429 endingPage "898" @default.
- W182969429 startingPage "893" @default.
- W182969429 abstract "We have already developed a flip-chip bonding technique, named Stud-Bump-Bonding (SBB ) technique, which can mount bare LSI chips directly onto ceramic(MCM-C) and organic substrates(MCM-L). Au bumps are formed on electrode pads of the LSI chip by a wire-bonding apparatus. Each Au bump has two-stepped construction and is bonded with conductive adhesive to an electrode terminal formed on the substrate. An epoxy under-fill resin is inserted to fill a gap between each LSI chip and the substrate. However it has been supposed that the Stud-Bump-Bonding technique using the wire bonding method was not suitable for area-array interconnection technology, because the bump formation process would do damage to active devices. We studied the damage to active devices such as MOSFETs and SRAMs caused by wire bonding, leveling of the bumps and its mounting It was found that the SBB can be applied onto the active devices by optimizing the equipment, bonding conditions and materials, Area-array interconnection will make possible high density interconnection and reduction of the size of LSI chips." @default.
- W182969429 created "2016-06-24" @default.
- W182969429 creator A5049620650 @default.
- W182969429 creator A5055535172 @default.
- W182969429 creator A5064186453 @default.
- W182969429 creator A5067543398 @default.
- W182969429 creator A5088130769 @default.
- W182969429 date "1998-01-01" @default.
- W182969429 modified "2023-09-24" @default.
- W182969429 title "Area-Array Interconnection Using Stud-Bump-Bonding" @default.
- W182969429 hasPublicationYear "1998" @default.
- W182969429 type Work @default.
- W182969429 sameAs 182969429 @default.
- W182969429 citedByCount "2" @default.
- W182969429 crossrefType "journal-article" @default.
- W182969429 hasAuthorship W182969429A5049620650 @default.
- W182969429 hasAuthorship W182969429A5055535172 @default.
- W182969429 hasAuthorship W182969429A5064186453 @default.
- W182969429 hasAuthorship W182969429A5067543398 @default.
- W182969429 hasAuthorship W182969429A5088130769 @default.
- W182969429 hasConcept C111368507 @default.
- W182969429 hasConcept C119599485 @default.
- W182969429 hasConcept C123745756 @default.
- W182969429 hasConcept C127313418 @default.
- W182969429 hasConcept C127413603 @default.
- W182969429 hasConcept C140269135 @default.
- W182969429 hasConcept C147789679 @default.
- W182969429 hasConcept C159985019 @default.
- W182969429 hasConcept C165005293 @default.
- W182969429 hasConcept C17525397 @default.
- W182969429 hasConcept C185592680 @default.
- W182969429 hasConcept C192562407 @default.
- W182969429 hasConcept C202374169 @default.
- W182969429 hasConcept C2777289219 @default.
- W182969429 hasConcept C2779227376 @default.
- W182969429 hasConcept C2984173401 @default.
- W182969429 hasConcept C49040817 @default.
- W182969429 hasConcept C68928338 @default.
- W182969429 hasConcept C76155785 @default.
- W182969429 hasConcept C79072407 @default.
- W182969429 hasConceptScore W182969429C111368507 @default.
- W182969429 hasConceptScore W182969429C119599485 @default.
- W182969429 hasConceptScore W182969429C123745756 @default.
- W182969429 hasConceptScore W182969429C127313418 @default.
- W182969429 hasConceptScore W182969429C127413603 @default.
- W182969429 hasConceptScore W182969429C140269135 @default.
- W182969429 hasConceptScore W182969429C147789679 @default.
- W182969429 hasConceptScore W182969429C159985019 @default.
- W182969429 hasConceptScore W182969429C165005293 @default.
- W182969429 hasConceptScore W182969429C17525397 @default.
- W182969429 hasConceptScore W182969429C185592680 @default.
- W182969429 hasConceptScore W182969429C192562407 @default.
- W182969429 hasConceptScore W182969429C202374169 @default.
- W182969429 hasConceptScore W182969429C2777289219 @default.
- W182969429 hasConceptScore W182969429C2779227376 @default.
- W182969429 hasConceptScore W182969429C2984173401 @default.
- W182969429 hasConceptScore W182969429C49040817 @default.
- W182969429 hasConceptScore W182969429C68928338 @default.
- W182969429 hasConceptScore W182969429C76155785 @default.
- W182969429 hasConceptScore W182969429C79072407 @default.
- W182969429 hasLocation W1829694291 @default.
- W182969429 hasOpenAccess W182969429 @default.
- W182969429 hasPrimaryLocation W1829694291 @default.
- W182969429 hasRelatedWork W1487777695 @default.
- W182969429 hasRelatedWork W1632177988 @default.
- W182969429 hasRelatedWork W1864944538 @default.
- W182969429 hasRelatedWork W1894386967 @default.
- W182969429 hasRelatedWork W1954898313 @default.
- W182969429 hasRelatedWork W2032273777 @default.
- W182969429 hasRelatedWork W2063085459 @default.
- W182969429 hasRelatedWork W2082941714 @default.
- W182969429 hasRelatedWork W2106272003 @default.
- W182969429 hasRelatedWork W2120100416 @default.
- W182969429 hasRelatedWork W2125968994 @default.
- W182969429 hasRelatedWork W2127713044 @default.
- W182969429 hasRelatedWork W2131662804 @default.
- W182969429 hasRelatedWork W2134936297 @default.
- W182969429 hasRelatedWork W2135385620 @default.
- W182969429 hasRelatedWork W2152472426 @default.
- W182969429 hasRelatedWork W2162488434 @default.
- W182969429 hasRelatedWork W2463844281 @default.
- W182969429 hasRelatedWork W3022880805 @default.
- W182969429 hasRelatedWork W3027836775 @default.
- W182969429 hasVolume "3582" @default.
- W182969429 isParatext "false" @default.
- W182969429 isRetracted "false" @default.
- W182969429 magId "182969429" @default.
- W182969429 workType "article" @default.