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• W1852343585 abstract "The effect of slurry composition and wafer flatness on a material removal rate (MRR) and resulting surface roughness which are evaluation parameters to determine the CMP characteristics of the on-axis 6H-SiC substrate were systematically investigated. 2-inch SiC wafers were fabricated from the ingot grown by a conventional physical vapor transport (PVT) method were used for this study. The SiC substrate after the CMP process using slurry added oxidizers into slurry consisted of KOH-based colloidal silica and nano-size diamond particle exhibited the significant MRR value and a fine surface without any surface damages. SiC wafers with high bow value after the CMP process exhibited large variation in surface roughness value compared to wafer with low bow value. The CMPprocessed SiC wafer having a low bow value of 1im was observed to result in the Root-mean-square height (RMS) value of 2.747 A and the mean height (Ra) value of 2.147 A." @default.
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• W1852343585 date "2011-07-31" @default.
• W1852343585 modified "2023-10-15" @default.
• W1852343585 title "The Effect of Slurry and Wafer Morphology on the SiC Wafer Surface Quality in CMP Process" @default.
• W1852343585 cites W2008081062 @default.
• W1852343585 cites W2012246352 @default.
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• W1852343585 doi "https://doi.org/10.4191/kcers.2011.48.4.312" @default.
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