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- W1853337206 abstract "Current leakage is the major failure mode of semiconductor device characteristic failures. Conventionally, failures such as short circuit breaks and gate breakdowns have been analyzed and the detected causes have been reflected in the fabrication process. By using a wafer-level emission-leakage failure analysis method (in-line QC), we analyzed leakage mode failure, which is the major failure detected during the probe inspection process for LSIs, typically DRAMs and CMOS logic LSIs. We have thus developed a new technique that copes with the critical structural failures and random failures that directly affect probe yields." @default.
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- W1853337206 date "2002-11-11" @default.
- W1853337206 modified "2023-09-27" @default.
- W1853337206 title "Analysis TAT reduction by using emission-leakage failure analysis system" @default.
- W1853337206 cites W85133518 @default.
- W1853337206 doi "https://doi.org/10.1109/issm.2000.993665" @default.
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