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- W1856558013 abstract "We demonstrate a novel method for indium bump fabrication on a small CMOS circuit chip that is to be flip-chip bonded with a GaAs/AlGaAs multiple quantum well spatial light modulator. A chip holder with a via hole is used to coat the photoresist for indium bump lift-off. The 1000 μm-wide photoresist edge bead around the circuit chip can be reduced to less than 500 μm, which ensures the integrity of the indium bump array. 64 × 64 indium arrays with 20 μm-high, 30 μm-diameter bumps are successfully formed on a 5 × 6.5 mm2 CMOS chip." @default.
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- W1856558013 date "2011-11-01" @default.
- W1856558013 modified "2023-09-24" @default.
- W1856558013 title "Indium bump array fabrication on small CMOS circuit for flip-chip bonding" @default.
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- W1856558013 doi "https://doi.org/10.1088/1674-4926/32/11/115014" @default.
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