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• W1856660755 abstract "Summary form only given. High-power diode lasers are important for a wide range of applications, e.g. as pump sources for solid state lasers and tools for material processing. For managing the thermal load connected with high power operation, complex device and heat sink architectures are required. In particular, the semiconductor structure must be mounted 'p-side down' on a heat sink of high thermal conductivity. In such a geometry, mechanical strain of the active region represents a central issue, affecting both the parameters of laser emission and the lifetime of the device." @default.
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• W1856660755 date "2003-01-20" @default.
• W1856660755 modified "2023-09-27" @default.
• W1856660755 title "Spectroscopic measurement of packaging induced strains in high-power laser diode arrays" @default.
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• W1856660755 doi "https://doi.org/10.1109/cleo.1999.834006" @default.
• W1856660755 hasPublicationYear "2003" @default.
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