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• W1876150198 abstract "The concept of inorganic nanostructured solar cells consists of a very thin absorber layer sandwiched between highly structured electron and hole conductors. When a TiO2/In2S3/CuSCN nanocomposite heterostructure is illuminated with light, photogenerated electrons in In2S3 can be injected into the conduction band of TiO2 and holes into the valence band of CuSCN. Charge transfer at the interfaces is limited by the deposition parameters, band alignment and diffusion of Cu from CuSCN into In2S3, which was the focus of this work. TiO2 nanoparticles were screen printed onto SnO2:F (FTO)-coated glass substrates to give a layer of nanoporous (np) TiO2. In2S3 layers were deposited by thermal evaporation or ion layer gas reaction (ILGAR) methods producing Cl-free (In(acac)3 precursor) and Cl-containing (InCl3 precursor) layers. A spray-spin method was developed for deposition of CuSCN onto In2S3. Diffusion of Cu into In2S3 layers was investigated by Rutherford backscattering spectrometry (RBS) while charge transport mechanisms were studied with surface photovoltage (SPV) technique in the fixed capacitor configuration. The activation energy (Ea) for Cu diffusion in thermally evaporated and Cl-free ILGAR In2S3 layers was 0.30 and 0.24 eV, respectively but increased to between 0.72 and 0.78 eV for Cl-containing In2S3 with residual Cl concentrations of 7.8 – 13.8 at.%. The diffusion prefactor (D0) was six orders of magnitude higher for Cl-containing compared to Cl-free layers. The relationship between Ea and D0 was described by the Meyer-Neldel rule with a Meyer-Neldel energy of 40 meV. The presence of Cl has no significant influence on the structural properties of In2S3 but resulted in a modified diffusion mechanism for Cu diffusion. The photovoltage of In2S3/CuSCN samples decreased after annealing for longer than 2 min at 200°C. A defect band was formed near the interface where holes accumulated and electrons tunneled through traps to recombine. The minimum distribution of tail states and hence the lowest disorder was achieved for Cl-containing In2S3 layers. The conduction band offset at the np-TiO2/In2S3 interface was 0.05 and 0.30 eV for Cl-free and Cl-containing In2S3, respectively. Bulk or interface recombination mechanism dominated charge transport at the interface with Cl-free or Cl-containing In2S3, respectively. Table of" @default.
• W1876150198 created "2016-06-24" @default.
• W1876150198 creator A5032040074 @default.
• W1876150198 date "2013-01-01" @default.
• W1876150198 modified "2023-09-27" @default.
• W1876150198 title "Copper diffusion in In2S3 and charge separation at In2S3/CuSCN and TiO2/In2S3 interfaces" @default.
• W1876150198 cites W1128981796 @default.
• W1876150198 cites W1507770381 @default.
• W1876150198 cites W1521127867 @default.
• W1876150198 cites W1539339298 @default.
• W1876150198 cites W1566517935 @default.
• W1876150198 cites W1572351909 @default.
• W1876150198 cites W1654537223 @default.
• W1876150198 cites W1661732800 @default.
• W1876150198 cites W1800384804 @default.
• W1876150198 cites W1837863733 @default.
• W1876150198 cites W1965716747 @default.
• W1876150198 cites W1968671914 @default.
• W1876150198 cites W1968683287 @default.
• W1876150198 cites W1970050163 @default.
• W1876150198 cites W1973926388 @default.
• W1876150198 cites W1974435968 @default.
• W1876150198 cites W1974978176 @default.
• W1876150198 cites W1978732821 @default.
• W1876150198 cites W1979906694 @default.
• W1876150198 cites W1981335509 @default.
• W1876150198 cites W1981688988 @default.
• W1876150198 cites W1983224487 @default.
• W1876150198 cites W1983887000 @default.
• W1876150198 cites W1989070902 @default.
• W1876150198 cites W1989734293 @default.
• W1876150198 cites W1991281199 @default.
• W1876150198 cites W1993621105 @default.
• W1876150198 cites W1994754877 @default.
• W1876150198 cites W1996310837 @default.
• W1876150198 cites W1996907220 @default.
• W1876150198 cites W1997681844 @default.
• W1876150198 cites W2000243793 @default.
• W1876150198 cites W2000570618 @default.
• W1876150198 cites W2001091745 @default.
• W1876150198 cites W2001928194 @default.
• W1876150198 cites W2004364782 @default.
• W1876150198 cites W2005455528 @default.
• W1876150198 cites W2005828400 @default.
• W1876150198 cites W2007387324 @default.
• W1876150198 cites W2007824922 @default.
• W1876150198 cites W2011181449 @default.
• W1876150198 cites W2017056704 @default.
• W1876150198 cites W2017220812 @default.
• W1876150198 cites W2019360522 @default.
• W1876150198 cites W2019546366 @default.
• W1876150198 cites W2021334633 @default.
• W1876150198 cites W2021591837 @default.
• W1876150198 cites W2022135717 @default.
• W1876150198 cites W2027572258 @default.
• W1876150198 cites W2027977561 @default.
• W1876150198 cites W2028215583 @default.
• W1876150198 cites W2029498255 @default.
• W1876150198 cites W2030208722 @default.
• W1876150198 cites W2032398045 @default.
• W1876150198 cites W2035099916 @default.
• W1876150198 cites W2037773093 @default.
• W1876150198 cites W2039144305 @default.
• W1876150198 cites W2041119155 @default.
• W1876150198 cites W2041838574 @default.
• W1876150198 cites W2041885149 @default.
• W1876150198 cites W2042325058 @default.
• W1876150198 cites W2043093476 @default.
• W1876150198 cites W2043124674 @default.
• W1876150198 cites W2044634628 @default.
• W1876150198 cites W2048531892 @default.
• W1876150198 cites W2049371162 @default.
• W1876150198 cites W2049589172 @default.
• W1876150198 cites W2057589047 @default.
• W1876150198 cites W2059166979 @default.
• W1876150198 cites W2070683660 @default.
• W1876150198 cites W2072609464 @default.
• W1876150198 cites W2074013165 @default.
• W1876150198 cites W2074560551 @default.
• W1876150198 cites W2074860172 @default.
• W1876150198 cites W2075343701 @default.
• W1876150198 cites W2079095710 @default.
• W1876150198 cites W2080437303 @default.
• W1876150198 cites W2081791862 @default.
• W1876150198 cites W2083124584 @default.
• W1876150198 cites W2083495455 @default.
• W1876150198 cites W2084313831 @default.
• W1876150198 cites W2084645196 @default.
• W1876150198 cites W2088967655 @default.
• W1876150198 cites W2089199209 @default.
• W1876150198 cites W2091347569 @default.
• W1876150198 cites W2092527008 @default.
• W1876150198 cites W2093196985 @default.
• W1876150198 cites W2104380120 @default.
• W1876150198 cites W2107265331 @default.
• W1876150198 cites W2113420097 @default.
• W1876150198 cites W2114118829 @default.
• W1876150198 cites W2135423186 @default.
• W1876150198 cites W2142555314 @default.
• W1876150198 cites W2156806959 @default.

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